Dimensity 9300+ with enhanced AI, faster X4-prime core, to be introduced May 7th

MediaTek's Dimensity 9300 application processor has a configuration made of up four Cortex-X4 CPU cores and four Cortex-A720 performance CPU cores. Unlike most smartphone chipsets, there are no low-power efficiency CPU cores that are used to handle less complex tasks. The Dimensity 9300 SoC is currently used to power the Vivo X100 series and so far,which is expected to feature a triple 50MP rear camera setup, a flat AMOLED display, and 125W wired fast charging.

And all of this is going on as MediaTek wraps up development of its next flagship chipset, the Dimensity 9400 AP. Expected to be ready for shipments in the fourth quarter of this year, the Dimensity 9400 SoC will be manufactured by TSMC using its second-generation 3nm process node and will be equipped with the next-generation Cortex-X5 CPU core. The rest of the chipset's configuration will remain the same with three Cortex-X4 performance CPU cores and four Cortex-A720 performance CPU cores.

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Source: Tech Daily Report (techdailyreport.net)

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