Taiwan Semiconductor Manufacturing Company's logo is seen while people attend the opening of the TSMC global R&D center in Hsinchu, Taiwan on Jul 28, 2023. TOKYO: Taiwan's TSMC is looking at building advanced packaging capacity in Japan, according to two sources familiar with the matter, a move that would add momentum to Japan's efforts to reboot its semiconductor industry.
CoWoS is a high-precision technology that involves stacking chips on top of each other, boosting processing power while saving space and reducing power consumption.No decisions on the scale or the timeline for a potential investment have been made, the source said.Demand for advanced semiconductor packaging has surged globally in tandem with the artificial intelligence boom, spurring chipmakers including TSMC, Samsung Electronics and Intel, to boost capacity.
TSMC is partnering with companies including Sony and Toyota with total investment in the Japan venture expected to run to more than US$20 billion. Advanced packaging would be welcomed in Japan which can offer the ecosystem to support it, a senior official at Japan's industry ministry said.
Source: News Formal (newsformal.com)
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