Nvidia supplier SK Hynix to invest $3.87 bln in US chip packaging plant

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The facility

SEOUL - SK Hynix, the world's second-largest memory chip maker, said on Wednesday it will invest around $3.87 billion to build an advanced packaging plant and research and development facility for AI products in the U.S. state of Indiana.

Mass production is planned to start in the second half of 2028. The new facility in West Lafayette, Indiana will also house a packaging R&D line. The engineering talent pool provided by the region's Purdue University, infrastructure for chip manufacturing, and support from the state and local government were factors in the chipmaker's decision, it said.

 

آپ کے تبصرے کا شکریہ۔ آپ کا تبصرہ جائزہ لینے کے بعد شائع کیا جائے گا۔
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پاکستان تازہ ترین خبریں, پاکستان عنوانات

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