Devindra has been writing about the way technology intersects with our lives for nearly 20 years. He started the Amherst Student's first technology column, worked in IT support for many (many) years, and eventually moved to Brooklyn to cover New York's tech scene in 2009.
What if you could take the benefits of solid-state speaker drivers — specifically, their extreme thinness and lack of moving parts — and bring them to cooling fans ? That's what xMEMS aims to do with its new XMC-2400 µCooling chip. It's a 1mm-tall solid-state fan on a chip that can actively cool extremely thin devices like smartphones and tablets.
Consider this real-world example: If my fan-less M2 MacBook Air had xMEMS' XMC-2400 chips installed, it wouldn't have died on me while I was working in the sun at Apple's WWDC last year. It's not hard to imagine other potential solutions: Headphones that can cool down your ears; gaming controllers that can keep your paws from getting sweaty; tablets that can eke out even more speed from their hardware.
According to Mike Housholder, xMEMS VP Marketing and Business Development, the XMC-2400 µCooling chip uses ultrasonic modulation to create pressure pulses for air movement. It weighs less than 150 milligrams and can move "up to 39 cubic centimeters of air per second with 1,000 Pascals of back pressure," xMEMS says.
Extreme Thinness Cooling Fans Moving Parts Mike Housholder
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