Have you ever imagined the process of creating the blueprint for a brand-new piece of PC hardware? If you’re picturing a bunch of engineers and a whiteboard, you’re probably not wrong, but sometimes, it all starts with a small idea jotted down during a slow meeting.
It’s been a big year for AMD, with the innovative 3D V-Cache Ryzen 5800X3D, next-gen Ryzen 7000, and lastly, RDNA 3 GPUs all being launched. In the case of the RX 7900 XTX and 7900 XT, the beasts that sit atop AMD’s new graphics cards lineup, it’s safe to say that the cards had rather humble beginnings. According to AMD fellow Andy Pomianowski, the initial idea for the new RDNA 3 architecture was conceived on a bit of napkin and a notepad found at a hotel.
AMD has made some pretty significant architectural changes with the switch to RDNA 3. The graphics cards now come with chiplets, bringing forth AMD’s Ryzen tech onto GPU territory, but done in a much different way. The graphics cards will come with one die that contains all of the graphics cores and then several dies dedicated to memory storage and Infinity Cache . AMD called the GPU core chip the graphics compute die and the memory controller chip the memory cache die .
According to PC Gamer, Naffziger sketched out something resembling the GCD and MCD duo that now powers up the next-gen graphics cards. Pomianowski liked the idea well enough to go through with it. “Start with a napkin. Then it’s PowerPoint, and then the engineering teams just do it,” Pomianowski joked, simplifying what must have been hundreds of hours’ worth of work for the AMD engineering team.
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