SAN FRANCISCO, July 27 — Intel Corp said on Monday its factories will start building Qualcomm Inc chips and laid out a roadmap to expand its new foundry business to catch rivals such as Taiwan Semiconductor Manufacturing Co and Samsung Electronics Co Ltd by 2025.
Intel said on Monday it expects to regain its lead by 2025 and described five sets of chipmaking technologies it will roll out over the next four years. Intel also said it will change its naming scheme for chipmaking technology, using names like “Intel 7” that align with how TSMC and Samsung market competing technologies.
Amazon, which is increasingly making its own data center chips for its Amazon Web Services, is not yet using Intel’s chipmaking technology but will use Intel’s packaging technology, the process of assembling chips and “chiplets” or “tiles”, often stacking them up in so-called 3D formation. Intel excels in this packaging technology, analysts say.
The biggest question facing Intel is whether it can make good on its technology promises after years of delays under previous Chief Executive Brian Krzanich. In recent weeks, Intel announced the delay of a new data center chip called Sapphire Rapids.
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